UTCS Colloquia - Wenping Wang/The University of Hong Kong, "Centroidal Voronoi Tessellation vs. Optimal Delaunay Triangulation", ACES 4.304

Contact Name: 
Jenna Whitney
May 4, 2011 1:30pm - 3:00pm

Type of Talk: Colloquia

Speaker/Affiliation: Wenping Wang/

The University of Hong Kong

Talk Audience: UTCS Faculty and Graduate S


Date/Time: Wednesday, May 4, 2011, 1:30 p.m.

ACE 4.304

Host: Chandrajit Bajaj

Talk Title: Centroidal Voronoi

Tessellation vs. Optimal Delaunay Triangulation

Talk Abstract:
We pr

esent a comparative study on CVT (Centroidal Voronoi Tessellation) and ODT

(Optimal Delaunay Triangulation), which are two closely related optimizati

on-based methods for mesh generation. While CVT is relatively well understo

od and widely applied, ODT has only recently been proposed as a promising

alternative to CVT for quality mesh generation. In the first part of this

talk we briefly introduce CVT and discuss its applications to mesh generati

on, circle packing, and minimal surface modeling. In the second part, we
examine numerical evidence that establishes the superiority of ODT over CV

T in suppressing slivers in tetrahedral meshes. Then, we propose a global

optimization scheme to improve the efficiency and robustness of ODT computa

tion and an extended ODT formulation for the generation of graded tetrahedr

al meshes. Throughout, emphasis is placed on comparing CVT and ODT in term

s of their formulations, properties, computations, and applications.

Speaker Bio:
Wenping Wang is Professor of Computer Science at The Unive

rsity of Hong Kong. He got B.Sc. (1983) and M.Eng. (1986) at Shandong Unive

rsity, China, and Ph.D. (1992) at University of Alberta, Canada, all in
computer science. His research covers computer graphics, visualization,

and geometric computing. He is Associate Editor of the Springer journal Com

puter Aided Geometric Design and IEEE Transactions on Visualization and Com

puter Graphics. He is program co-chair of several international conferences

, including Geometric Modeling and Processing (GMP 2000), Pacific Graphic

s 2003, ACM Symposium on Physical and Solid Modeling (SPM 2006), and IEEE
International Conference on Shape Modeling (SMI 2009).